| تعداد نشریات | 24 |
| تعداد شمارهها | 907 |
| تعداد مقالات | 8,104 |
| تعداد مشاهده مقاله | 15,471,871 |
| تعداد دریافت فایل اصل مقاله | 13,135,705 |
Effect of Interpass Annealing on the Microstructure, Nanoindentation Hardness, and Electrical Conductivity of 20-μm Cold-Rolled Copper Foils | ||
| Iranian Journal of Materials Forming | ||
| مقالات آماده انتشار، پذیرفته شده، انتشار آنلاین از تاریخ 16 خرداد 1405 اصل مقاله (916.77 K) | ||
| نوع مقاله: Research Paper | ||
| شناسه دیجیتال (DOI): 10.22099/ijmf.2026.55041.1366 | ||
| نویسندگان | ||
| Amin Adel shahbazi1؛ Hamid Reza shahverdi* 1؛ Ali Akbar Mottahedi2 | ||
| 1Department of Materials Engineering, Tarbiat Modares University, Tehran, Iran | ||
| 2Department of Advanced Materials and Renewable Energy, Iranian Research Organization for Science and Technology, Tehran, Iran | ||
| چکیده | ||
| Copper foils play essential roles in electronic technologies, including lithium-ion batteries, printed circuit boards, and electrical interconnects, where microstructure, hardness, and electrical conductivity critically determine performance. Achieving the optimal combination of these properties is therefore central to producing high-quality foils. In this work, 20-μm-thick copper foil was fabricated from tough pitch copper (TPC) through cold rolling, and interpass annealing was applied to tailor and improve these key characteristics. The material was first rolled from 100 µm to 30 µm, followed by interpass annealing for all samples except A0. Rolling was continued to achieve a final thickness of 20 µm. Annealing treatments were performed at 150, 200, 250, and 300 °C for 10, 15, 20, and 30 minutes. Microstructure, hardness, and electrical conductivity were characterized using optical microscopy, nanoindentation, and four-point probe measurements. The as-rolled sample (A0) showed elongated, highly deformed grains (17.64 µm), elevated hardness (124.09 HV), and the lowest conductivity (84.39% IACS). Significant improvements were observed in samples B4 and C1, where recrystallization produced refined grains (4.01 µm in B4 and 3.47 µm in C1), reduced hardness (64.56 HV and 55.36 HV, respectively), and enhanced conductivity (88.99% and 89.76% IACS, respectively). Continued annealing led to grain growth, with D4 exhibiting the highest conductivity (96.29% IACS). Overall, the influence of interpass annealing was evaluated across all processing conditions, and the results indicated that the routes used for samples B4 and C1 were optimal for producing 20-µm copper foil suitable for electronic applications. Depending on available equipment, either route can be selected for industrial production. | ||
| کلیدواژهها | ||
| Tough pitch copper؛ Printed circuit board؛ Recrystallization؛ Grain size؛ Foil rolling | ||
| مراجع | ||
|
[1] Davis, J. R. (2001). Copper and copper alloys. ASM International.
[2] Sousa, T. G. D., Sordi, V. L., & Brandão, L. P. (2017). Dislocation density and texture in copper deformed by cold rolling and ECAP. Materials Research, 21(1), e20170515. https://doi.org/10.1590/1980-5373-mr-2017-0515
[3] Chen, J., Xu, W., Yang, J., Yang, Z., Shi, H., Lin, G., Li, Z., Shen, X., Jiang, B., Liu, H., & Gui, K. (2024). Effects of cold rolling path on recrystallization behavior and mechanical properties of pure copper during annealing. Transactions of Nonferrous Metals Society of China, 34(10), 3233-3250. https://doi.org/10.1016/S1003-6326(24)66605-7
[4] Wang, L., Bai, Z., Sun, W., Du, L., Peng, X., Xiao, Y., Zhang, J., Jia, Y., Du, S., Cai, H., & Liu, E. (2023). Effect of low temperature annealing on microstructure and properties of copper foil. Materials Today Communications, 36, 106617. https://doi.org/10.1016/j.mtcomm.2023.106617
[5] Shi, H., Gan, W., Esling, C., Zhang, Y., Wang, X., Maawad, E., Stark, A., Li, X., & Wang, L. (2023). Recrystallization texture evolution of cold-rolled Cu foils governed by microstructural and sample geometrical factors during heating. Materials Characterization, 196, 112605. https://doi.org/10.1016/j.matchar.2022.112605
[6] E04 Committee. (2013). Test methods for determining average grain size. ASTM International. https://doi.org/10.1520/E0112-13
[7] E28 Committee. (2003). Test method for Vickers hardness of metallic materials. ASTM International. https://doi.org/10.1520/E0092-16
[8] E1004-23 Committee. (2017). Test method for determining electrical conductivity using the electromagnetic (eddy-current) method. ASTM International. https://doi.org/10.1520/E1004-17
[9] ASTM B667 - 97 Committee. (2019). Practice for construction and use of a probe for measuring electrical contact resistance. ASTM International. https://doi.org/10.1520/B0667-97R19
[10] Hosford, W. F., & Caddell, R. M. (2007). Metal Forming. Cambridge University Press. https://doi.org/10.1017/CBO9780511811111
[11] Clemens, H., Mayer, S., & Scheu, C. (2017). Microstructure and properties of engineering materials. Neutrons and Synchrotron Radiation in Engineering Materials Science, 1-20. Wiley. https://doi.org/10.1002/9783527684489.ch1
[12] Humphreys, F. J., & Hatherly, M. (2012). Recrystallization and related annealing phenomena. Elsevier. https://doi.org/10.1016/B978-0-08-044164-1.X5000-2
[13] Cao, J., Zhang, J., Tang, H., Shen, X., Song, K., Zhou, Y., & Cui, C. (2025). Investigation on the microstructure evolution and strengthening behavior of rolled bonding Cu strip. Journal of Science: Advanced Materials and Devices, 10(1), 100835. https://doi.org/10.1016/j.jsamd.2024.100835
[14] Merchant, H. D., Liu, W. C., Giannuzzi, L. A., & Morris, J. G. (2004). Grain structure of thin electrodeposited and rolled copper foils. Materials Characterization, 53(5), 335-360. https://doi.org/10.1016/j.matchar.2004.07.013
[15] Bhaduri, A. (2018). Mechanical Properties and Working
of Metals and Alloys, 264. Springer Singapore. https://doi.org/10.1007/978-981-10-7209-3
[16] Hosford, W. F. (2005). Mechanical Behavior of Materials. Cambridge University Press. https://doi.org/10.1017/CBO9780511810930
[17] Feng, R., Zhao, W., Sun, Y., Wang, X., Gong, B., Chang, B., & Feng, T. (2022). Softened microstructure and properties of 12 μm thick rolled copper foil. Materials, 15(6), 2249. https://doi.org/10.3390/ma15062249
[18] Song, M., Liu, X., & Liu, L. (2017). Size effect on mechanical properties and texture of pure copper foil by cold rolling. Materials, 10(5), 538. https://doi.org/10.3390/ma10050538
[19] Chen, Z., Fu, H., Zhang, C., Chen, J., Xu, Y., Zheng, Y., Zhong, Y., Wang, X., Gu, C., & Tu, J. (2025). Copper foils for high-energy-density lithium batteries: Composite vs. ultrathin. Journal of Energy Storage, 139, 118917. https://doi.org/10.1016/j.est.2025.118917
[20] Ziman, J. M. (2007). Electrons and phonons: The theory of transport phenomena in solids. Clarendon Press; Oxford University Press.
[21] Mayadas, A. F., & Shatzkes, M. (1970). Electrical-resistivity model for polycrystalline films: The case of arbitrary reflection at external surfaces. Physical Review B, 1(4), 1382-1389. https://doi.org/10.1103/PhysRevB.1.1382
[22] Solouki, H., Jamaati, R., & Aval, H. J. (2025). Influence of asymmetric rolling paths on the microstructure, texture, mechanical behavior, and electrical conductivity of electrolytic tough pitch copper. Materials Chemistry and Physics, 332, 130246. https://doi.org/10.1016/j.matchemphys.2024.130246
[23] Bishara, H., Lee, S., Brink, T., Ghidelli, M., & Dehm, G. (2021). Understanding grain boundary electrical resistivity in Cu: The effect of boundary structure. ACS Nano, 15(10), 16607-16615. https://doi.org/10.1021/acsnano.1c06367
[24] Xiong, S., Sun, J., Xu, Y., & Yan, X. (2015). Effect of lubricants and annealing treatment on the electrical conductivity and microstructure of rolled copper foil. Journal of Electronic Materials, 44(7), 2432-2439. https://doi.org/10.1007/s11664-015-3772-y
[25] Solouki, H., Jamaati, R., & Jamshidi Aval, H. (2024). High-temperature annealing behavior of cold-rolled electrolytic tough pitch copper. Heliyon, 10(12), e33276. https://doi.org/10.1016/j.heliyon.2024.e33276
[26] Shingledecker, J., Griscom, E., & Bridges, A. (2023). Relationship between grain size and sample thickness on the creep-rupture performance of thin metallic sheets of INCONEL alloy 740H. Journal of Materials Engineering and Performance, 32(20), 9309-9322. https://doi.org/10.1007/s11665-022-07785-2
[27] Souza, C. R. D., & Monlevade, E. F. D. (2021). Effect of cold rolling path on the deformation textures of C10300 copper. Materials Research, 24(2), e20200332. https://doi.org/10.1590/1980-5373-mr-2020-0332
[28] Chang, S. Y., & Chang, T. K. (2007). Grain size effect on nanomechanical properties and deformation behavior of copper under nanoindentation test. Journal of Applied Physics, 101(3). https://doi.org/10.1063/1.2432873
[29] Zhang, H. M., Dong, X. H., Wang, Q., & Peng, F. (2013). The experimental and numerical investigation on the mechanical properties of metallic foil. Advanced Materials Research, 705, 228-233. https://doi.org/10.4028/www.scientific.net/AMR.705.228 | ||
|
آمار تعداد مشاهده مقاله: 9 تعداد دریافت فایل اصل مقاله: 5 |
||