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Besharati, F., Paydar, M.H.. (1402). Fabrication of Copper Open Cell Foam by Electrochemical Deposition Method and Investigation on the Effect of Current Intensity and Plating Solution on the Created Microstructure. , 10(1), 4-12. doi: 10.22099/ijmf.2023.46551.1245
F. Besharati; M.H. Paydar. "Fabrication of Copper Open Cell Foam by Electrochemical Deposition Method and Investigation on the Effect of Current Intensity and Plating Solution on the Created Microstructure". , 10, 1, 1402, 4-12. doi: 10.22099/ijmf.2023.46551.1245
Besharati, F., Paydar, M.H.. (1402). 'Fabrication of Copper Open Cell Foam by Electrochemical Deposition Method and Investigation on the Effect of Current Intensity and Plating Solution on the Created Microstructure', , 10(1), pp. 4-12. doi: 10.22099/ijmf.2023.46551.1245
Besharati, F., Paydar, M.H.. Fabrication of Copper Open Cell Foam by Electrochemical Deposition Method and Investigation on the Effect of Current Intensity and Plating Solution on the Created Microstructure. , 1402; 10(1): 4-12. doi: 10.22099/ijmf.2023.46551.1245


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