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Fabrication of Copper Open Cell Foam by Electrochemical Deposition Method and Investigation on the Effect of Current Intensity and Plating Solution on the Created Microstructure | ||
| Iranian Journal of Materials Forming | ||
| مقاله 2، دوره 10، شماره 1، فروردین 2023، صفحه 4-12 اصل مقاله (2.27 M) | ||
| نوع مقاله: Research Paper | ||
| شناسه دیجیتال (DOI): 10.22099/ijmf.2023.46551.1245 | ||
| نویسندگان | ||
| F. Besharati؛ M.H. Paydar* | ||
| Department of Materials Science and Engineering, School of Engineering, Shiraz University, Shiraz, Iran | ||
| چکیده | ||
| Copper foams with open cells are suitable for use in battery electrodes, catalysts, filters, sound insulation, heat and catalytic exchangers due to the unique combination of properties such as high thermal and electrical conductivity and very low density. In the current research, copper foam containing open cells are produced using polyurethane polymer substrate with the help of electroless-electrochemical deposition, combined methods. The effect of various parameters, including the current intensity of the electro-deposition process, the presence of sulfuric acid and various additives in the electrochemical plating solution, on the microstructure of produced open-cell copper foam is investigated. The purity and microstructure of the fabricated foam are analyzed by X-ray diffraction (XRD) and scanning electron microscope (SEM). Mechanical strength of the foams are evealuted with a compression test. The results show that the current intensity in the range of 0.1-0.2 A is suitable for creating a uniform deposit. Moreover, it has been shown that, copper open cell foam with a uniform microstructure can be created by applying 0.1 A current, plating duration of 48 h and with plating solution including; aqueous copper sulfate 65 g/L, sulfuric acid 30 ml/L, phosphoric acid 2 ml/L, dextrin 20 mg/L, thiourea 20 mg/L, potassium chloride 2 g/L and sodium sulfate 25 g/L. Compression test results show that the compressive strength of the foam is about 0.82 MPa, the plateau stress is 0.52 MPa, and the absorption energy is about 0.5 MJ/m3. | ||
| کلیدواژهها | ||
| Copper open cell foam؛ Electroless deposition؛ Electrochemical deposition؛ Microstructure؛ Mechanical strength | ||
| مراجع | ||
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[1] B. Jiang, Ch. He, N. Zhao, P. Nash, C. Shi, Z. Wang, Ultralight metal foams, Scientific Reports. 5(1) (2015) 13825.
[2] N.A. Mohd Zahri, F. Yusof, T. Ariga, A.M.A. Haseeb, M.A. Mansoor, N.L. Sukiman, Open-cell copper foam joining: joint strength and interfacial behaviour, Materials Science and Technology, 35(16) (2019) 2004 -2012.
[3] A. Kulshreshtha, S.K. Dhakad, Preparation of metal foam by different methods: A review, Materials Today: Proceedings, 26 (2020) 1784-1790.
[4] F. García-Moreno, Commercial applications of metal foams: Their properties and production, Materials. 9(2) (2016) 85-112.
[5] Q.H. Tian, X.Y. Guo, Electroless copper plating on microcellular polyurethane foam, Transactions of Nonferrous Metals Society of China, 20 (2010) s283-s287.
[6] B.A. Birnbaum, N. Bilow, Metallized polymeric foam material, No. ARC-10860, 1974.
[7] M. Shahsavan, S.M.H. Mirbaghri, Production of copper open cell foam and investigating its microstructure, Journal of New Materials, 8(31) (2018) 1-16.
[8] M. Jafari Esfad, A. Molodi, Investigation of the effect of current type and electrolyte solution on the structure and mechanical properties of nickel open cell foam produced by electrochemical deposition method, Proceedings of the 8th International Conferenece and Exhibition of Materials Engineering and Metallurgy and 13th Joint National Conference of Metallurgical Engineering Association and Iran Materials and Iran Foundry Association, Tehran, Iran, 2018.
[9] W. Sha, X. Wu, K.G. Keong, Electroless copper and nickel-phosphorus plating. Woodhead Publishing, 2011, pp.15-35.
[10] Y.D. Gamburg, G. Zangari, Theory and practice of metal electrodeposition, Springer Science & Business Media, 2011, pp. 17–19.
[11] M.W. Losey, J. J. Kelly, Electrodeposition, In “Comprehensive Microsystems”, edited by Y.B. Gianchandani, O. Tabata, H. Zappe, Elsevier, Oxford, 2008, pp. 271-292.
[12] Q. Qing, F. Wang, Effect of sulfuric acid concentration on the quality of copper microcolumns in localized electrochemical deposition", Materials Research Express, 7(5) (2020) 056515.
[13] I. Rose, C. Whittington, Nickel plating handbook, Nickel Institute: Brussels, Belgium, 2014, pp. 1-80.
[14] J.J.F. Beaver, Bright copper plating, U.S. Patent No. 2,391,289. Washington, DC: U.S. Patent and Trademark Office, 1945.
[15] S. Rohani Nejad, M. Hosseinpour, S.M.H. Mirbagheri, Investigation of energy absorption behavior of light sandwich panel with nickel/polymer open-cell foam core during compression", Advanced Engineering Materials, 24(12) (2022) 2200663.
[16] N.A. Endut, M.H.F. Al Hazza, A.A. Sidek, E.T.Y. Adesta, N.A. Ibrahim, Compressive behaviour and energy absorption of aluminium foam sandwich, In IOP Conference Series: Materials Science and Engineering, 290(1) (2018) 012084.
[17] F. Hassanli, M.H. Paydar, Improvement in energy absorption properties of aluminum foams by designing pore-density distribution, Materials Research and Technology, 14 (2021) 609-619. | ||
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